Industry Leaders to Address Critical Cooling and Power Challenges in Next-Generation Data Centers

Colovore, a high-density colocation data center provider, announced that Michael Fulkerson, Vice President of Facilities & Operations, will participate in a featured panel discussion at the DICE Data Center Management, Operations & Cooling-West conference in Santa Clara on October 2, 2025. The panel titled "The Future of Data Center Cooling: How Will High Density Chips Impact Cooling and Power Infrastructure?" will address the critical technical challenges facing data center operators as GPU densities approach 1000kW per rack.

This exponential increase in power density is forcing the industry to fundamentally rethink facility design across multiple layers, including heat rejection, cooling efficiency, power delivery, and long-term scalability. The discussion will explore how leading organizations are preparing for these near-term realities and what innovations are required to sustain the next wave of digital infrastructure growth. Panelists include representatives from major industry players including Google, BP, Wesco, Equinix, and CoolIT Systems, alongside Colovore's expertise in ultra-dense, liquid-cooled data centers.

The implications of these rising power densities extend beyond immediate technical challenges to broader industry concerns about energy consumption, sustainability, and operational costs. As AI, machine learning, and high-performance computing workloads continue to grow, the ability to effectively manage heat dissipation and power distribution becomes increasingly critical for maintaining operational reliability and economic viability. The panel's focus on high-density chip impacts reflects the industry's recognition that current cooling and power infrastructure approaches may be inadequate for future demands.

Colovore's involvement in this discussion is particularly relevant given the company's specialization in purpose-built infrastructure engineered specifically for intense power and cooling requirements. With over a decade of experience supporting next-generation chips, Colovore has developed advanced liquid-cooling technology capable of delivering power densities from 17kW to over 350kW per cabinet. This expertise positions the company at the forefront of addressing the infrastructure challenges highlighted in the panel discussion.

The conference session, scheduled for 9:55 AM to 10:50 AM PST, represents a significant gathering of industry thought leaders focused on solving one of the most pressing issues in data center operations. The collective expertise of the panelists from diverse organizations including www.colovore.com provides comprehensive insight into both current best practices and future innovations needed to support the continuing growth of digital infrastructure demands driven by advancing computational technologies.